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Semtech 将 50G 前传引入先进 5G
Semtech has moved its 50G mobile transport portfolio into full production, targeting the higher fronthaul capacity needed for 5G-Advanced radio networks. The semiconductor portfolio supports 10 km, 15 km bidirectional (BiDi), and wavelength division multiplexing (WDM) optical links. Read more
Wireless Transceiver Now in Full Production for 10 km, 15 km BiDi and WDM Links
Semtech announced full production availability of its mobile transport portfolio enabling 50G fronthaul for the next wave of 5G Advanced radio deployments. Read more
Semtech 助力 AI 驱动的 5G-Advanced 实现 50G 光通信演进
适用于 10 km、15 km BiDi 和 WDM 链路的无线收发器现已全面量产 阅读更多
Semtech 持续推进面向数据中心的 NPO 和 CPO
AT CIOE in Shenzhen, Semtech introduced a family of 224G linear transimpedance amplifier (TIA) and drivers, designed to accelerate the deployment of Read more
Semtech 推出面向下一代移动前传应用的 50G 光学器件
Semtech said it has commenced production of integrated silicon subsystems intended for 50G optical transceivers in fronthaul cellular radios. A solution pairing Semtech's GN225 Clock and Data Recovery chip with the GN1700TI TIA caters to 10 km duplex radio links, while 15 km bi-directional links are served by the GN2255S CDR and GN1700TI TIA. Semtech will also market a solution pairing the GN1700TI TIA with its GN2256 CDR model, targeting WDM links and extended-reach architectures. Read more
ECOC：Semtech 携 200G/通道驱动器加入 XPO MSA，用于 12.8T 光器件
Semtech joins the XPO MSA with a portfolio of 200G/lane TIAs and Mach-Zehnder modulator drivers targeting 12.8 Tbps liquid-cooled pluggable optical modules for next-generation AI networks. Read more
Semtech 表示，LoRa 无线技术正越来越多地用于监测太阳能电站中除面板以外的设备，尤其是公用事业规模电站的跟踪器、逆变器，以及清洁机器人。
Semtech Corporation has announced its membership in the eXtra-dense Pluggable Optics Multi-Source Agreement (XPO MSA). This industry initiative aims to enable high-bandwidth AI optical interconnects for AI network infrastructure. Read more
Semtech 设定面向数据中心链路的 200G LPO 目标
Semtech has outlined power, reach and loss targets for 200G linear pluggable optics, setting out its current assumptions for data centre links. Read more
铜缆在 448G 时代仍具备扩展能力吗？
Can copper continue to scale for next-generation AI data center interconnects? Developed by TE Connectivity in collaboration with Semtech, this DesignCon 2026 Best Paper Award-winning technical paper explores passive and active copper architectures—including DAC, ACC, and Co-Packaged Copper (CPC)—and how they can help enable the transition to the 448G era. Read more
