NT24L50
NT24L50 是一款高灵敏度的跨阻放大器 (TIA)，具备自动增益控制 (AGC) 功能，以 CMOS 工艺制作。AGC 能实现超过 34dB 的动态工作范围，可打造高性能 TIA，适用于 EPON 收发器、千兆以太网和光纤通道等成本敏感的光纤应用。
功能
- 与 0.9 A/W PIN 型二极管（CPD = 0.65 pF，BER = 10-10）配合使用且速率为 1.25 Gbps 时，灵敏度为 -31 dBm（典型值）、过载为 +3 dBm
- 典型跨阻：27kΩ
- Manufactured in low cost, pure CMOS process
- Single +3.3V power supply
- Differential data outputs
- Internal regulated photodiode bias
- No internal ROSA VDD supply decoupling capacitor required for typical operation
- 光电二极管电流监控输出 — 可编程为拉电流或灌电流
- Data polarity invert function
- 兼容焊盘，可直接用作 Mindspeed M02016 的简易替换器件
- GbE/EPON
应用
封装
- 裸芯片
订购代码
Pb(Lead)-Free/RoHS-Green Info
（-40°C 至 +85°C / 4000 循环）
（50°C，4000 小时）
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资源
To see more videos Videos
From smartphones and laptops, to ATMs and online shopping, data is constantly in flight. As consumer technology and industry innovations advance, global data creation is projected to grow to 175 zettabytes (ZB) by 2025. Nearly 53ZB of that data will be consumed in real time—the data equivalent of streaming 583 billion 4K videos at once—which will strain current network infrastructure.
Semtech’s Tri-Edge™ GN2255 is the industry’s first analog IC solution enabling ultra-low latency, less than 1.5W module power, and performance for up to 10km reach for 50Gbps PAM4 SFP56 optical modules. Based on the proven Tri-Edge CDR platform qualified in data center applications, the new solution delivers the cost effectiveness, small footprint, low power, ultra-low latency, and performance demanded by 5G front haul applications. The new Tri-Edge GN2255 enables 50Gbps PAM4 links that will double the bandwidth of currently deployed 25Gbps NRZ front haul links. Semtech’s introduction of the Tri-Edge 5G wireless IC will help support new 5G applications, including edge computing, enhanced mobile broadband and device streaming, and fixed wireless access (i.e., home Internet). Learn more about the product announcement here.
今年早些时候，评估工程 (EE) 与 Semtech 信号完整性产品事业部高级营销经理 Raza Khan 进行了交谈，讨论了行业趋势和新 Tri-Edge 5G 无线产品。
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在 2018 年进行了大量演示和 alpha 模块测试之后，双密度版本的四通道小型可插拔 (QFSP) 多源协议 (MSA) 模块标准有望成为新线卡的规则。QSFP-DD 热潮的隐含意义不是模块本身的物理特性，而是转向先进信令方法的趋势。十年前，QSFP28 的问世预示着使用 NRZ 信令的 25Gbps 电通道即将占据主导地位。如今，QSFP-DD 及其更庞大的表亲 —— 八进制 SFP 或 OSFP ，都使用 PAM4 信令。其用得最多的是 50Gbps 通道。但 QSFP-DD 足够灵活，可以在各种实施中使用八通道接口：25G x 8 用于 200Gbit 以太网，50G x 8 用于 400Gbit 以太网，可能还有一些早期的 100G x 8 用于预标准 800Gbit 以太网。
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Slow but steady advances were made in 2018 in on-board optical links for chip-to-chip and chip-to-module interfaces. The integrated-optics revolution, anticipated three years ago when the Consortium for On-Board Optics (COBO), of which Semtech is an associate member, was launched, has been replaced by a realization that only slow migration from traditional pluggable modules will serve the data center, whether within a single line card or server blade, or between cards and racks. Even as recent as a year ago, COBO members began rethinking and changing their tune to stress coexistence of pluggable MSA modules and the embedded on-board modules chosen by COBO as a de facto standard.
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