GN7153B
GN7153B 是一款收发合一的 10Gbps EML 激光驱动器/时钟和数据恢复 (CDR),具有突发模式限制放大器,适用于 XGS-PON 应用。传输眼图成型技术与 Semtech ClearEdge® CDR 相结合,以实现高质量的驱动器输出。宽动态范围 APC 环路支持多种 TOSA。突发模式限幅放大器集成了交流耦合电容,满足严格的 XGS-PON 定时要求。带有传感器的集成 ADC 提供数字诊断信息。GN7153B 的应用包括 XGS-PON 和 XGS Combo-PON 光线路终端 (OLT) 模块。
功能
- 10G/2.5Gbps 接收器,10Gbps 发射器
- 集成无参考 CDR 的 EAM/EML 激光驱动器
- 突发模式限幅放大器
- 速率选择和重置功能
- I2C 数字控制
- 用于 DDMI 合规实施的集成模数转换器
- 集成激光安全、平均功率和消光比控制
- XGS-PON OLT 模块
- XGS 组合-PON OLT 模块
应用
封装
- QFN-32
订购代码
Pb(Lead)-Free/RoHS-Green Info
(-40°C 至 +85°C / 4000 循环)
(50°C,4000 小时)
Related Parts
GN7153B-INTE3Z
探索丰富的可下载资源和数据表,帮助原型制作和生产。
登录或注册 mySemtech,以获得限定的产品文档,并将文档添加到观察清单以获得更新提醒
Distributor/Catalog Supplier Inventory
View product availability from participating distributors below. Browse all distributers here.
Part # | 国家/地区 | Qty | Buy | 经销商 |
---|
资源
To see more videos Videos
Semtech’s Tri-Edge™ GN2255 is the industry’s first analog IC solution enabling ultra-low latency, less than 1.5W module power, and performance for up to 10km reach for 50Gbps PAM4 SFP56 optical modules. Based on the proven Tri-Edge CDR platform qualified in data center applications, the new solution delivers the cost effectiveness, small footprint, low power, ultra-low latency, and performance demanded by 5G front haul applications. The new Tri-Edge GN2255 enables 50Gbps PAM4 links that will double the bandwidth of currently deployed 25Gbps NRZ front haul links. Semtech’s introduction of the Tri-Edge 5G wireless IC will help support new 5G applications, including edge computing, enhanced mobile broadband and device streaming, and fixed wireless access (i.e., home Internet). Learn more about the product announcement here.
今年早些时候,评估工程 (EE) 与 Semtech 信号完整性产品事业部高级营销经理 Raza Khan 进行了交谈,讨论了行业趋势和新 Tri-Edge 5G 无线产品。
立即阅读在 2018 年进行了大量演示和 alpha 模块测试之后,双密度版本的四通道小型可插拔 (QFSP) 多源协议 (MSA) 模块标准有望成为新线卡的规则。QSFP-DD 热潮的隐含意义不是模块本身的物理特性,而是转向先进信令方法的趋势。十年前,QSFP28 的问世预示着使用 NRZ 信令的 25Gbps 电通道即将占据主导地位。如今,QSFP-DD 及其更庞大的表亲 —— 八进制 SFP 或 OSFP ,都使用 PAM4 信令。其用得最多的是 50Gbps 通道。但 QSFP-DD 足够灵活,可以在各种实施中使用八通道接口:25G x 8 用于 200Gbit 以太网,50G x 8 用于 400Gbit 以太网,可能还有一些早期的 100G x 8 用于预标准 800Gbit 以太网。
立即阅读Slow but steady advances were made in 2018 in on-board optical links for chip-to-chip and chip-to-module interfaces. The integrated-optics revolution, anticipated three years ago when the Consortium for On-Board Optics (COBO), of which Semtech is an associate member, was launched, has been replaced by a realization that only slow migration from traditional pluggable modules will serve the data center, whether within a single line card or server blade, or between cards and racks. Even as recent as a year ago, COBO members began rethinking and changing their tune to stress coexistence of pluggable MSA modules and the embedded on-board modules chosen by COBO as a de facto standard.
立即阅读