GN1158
本规范定义了用于速率从 1.0Gbps 至 11.3Gbps 的 SR 以太网和光纤通道应用的多速率收发器 IC。包括 IEEE 802.3 和 1、2、4、8 定义的 1 Gbps 和 10 Gbps 的以太网数据速率和 10 Gbps 的光纤通道数据速率。
功能
- 功耗典型值为 180mW(IBIAS = 0mA、IMOD = 0mAppd)
- VCSEL 激光驱动器:
- 最大偏置电流 = 15mA
- 最大调制电流驱动 50Ω 差动电阻 TOSA = 20mApp
- Tx DJ = 5 pspp;Tx RJ = 0.5 psrms
- 集成闭环自动功率控制 (APC)
- 兼容基于微控制器的调制电流/温度查表法
- 可编程 Tx 眼图成型功能和输入均衡功能
- 可编程上升/下降时间
- 激光安全功能
- 可切换 Tx 极性反转
- 限幅放大器接收器:
- 数据传输速率为 11.317 Gb/s 时,Rx 灵敏度 = 5 mVppd
- Rx DJ = 4 pspp;Rx RJ = 0.7 psrms
- 可编程带宽
- Rx 输出预加重和静噪
- 可编程 Rx 输出摆幅
- 可编程上升/下降时间
- 信号丢失检测阈值可调
- 可切换 Rx 极性反转
- 数字诊断和监控参数测量
- 两线串行接口,用于主机通信
- 软件可选断电模式
- 控制线路和状态线路用 3.3 V 或 2.5 V CMOS 输入和开漏输出
- 数据通信
- 电信
应用
封装
- 28 引脚 QFN
订购代码
- GN1158-INE3 - 4 mm x 4 mm
- GN1158-INTE3 - 4 mm x 4 mm,卷带包装,2500 颗/卷
Pb(Lead)-Free/RoHS-Green Info
(-40°C 至 +85°C / 4000 循环)
(50°C,4000 小时)
Related Parts
GN1158-INTE3Z
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资源
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Semtech’s Tri-Edge™ GN2255 is the industry’s first analog IC solution enabling ultra-low latency, less than 1.5W module power, and performance for up to 10km reach for 50Gbps PAM4 SFP56 optical modules. Based on the proven Tri-Edge CDR platform qualified in data center applications, the new solution delivers the cost effectiveness, small footprint, low power, ultra-low latency, and performance demanded by 5G front haul applications. The new Tri-Edge GN2255 enables 50Gbps PAM4 links that will double the bandwidth of currently deployed 25Gbps NRZ front haul links. Semtech’s introduction of the Tri-Edge 5G wireless IC will help support new 5G applications, including edge computing, enhanced mobile broadband and device streaming, and fixed wireless access (i.e., home Internet). Learn more about the product announcement here.
今年早些时候,评估工程 (EE) 与 Semtech 信号完整性产品事业部高级营销经理 Raza Khan 进行了交谈,讨论了行业趋势和新 Tri-Edge 5G 无线产品。
立即阅读在 2018 年进行了大量演示和 alpha 模块测试之后,双密度版本的四通道小型可插拔 (QFSP) 多源协议 (MSA) 模块标准有望成为新线卡的规则。QSFP-DD 热潮的隐含意义不是模块本身的物理特性,而是转向先进信令方法的趋势。十年前,QSFP28 的问世预示着使用 NRZ 信令的 25Gbps 电通道即将占据主导地位。如今,QSFP-DD 及其更庞大的表亲 —— 八进制 SFP 或 OSFP ,都使用 PAM4 信令。其用得最多的是 50Gbps 通道。但 QSFP-DD 足够灵活,可以在各种实施中使用八通道接口:25G x 8 用于 200Gbit 以太网,50G x 8 用于 400Gbit 以太网,可能还有一些早期的 100G x 8 用于预标准 800Gbit 以太网。
立即阅读Slow but steady advances were made in 2018 in on-board optical links for chip-to-chip and chip-to-module interfaces. The integrated-optics revolution, anticipated three years ago when the Consortium for On-Board Optics (COBO), of which Semtech is an associate member, was launched, has been replaced by a realization that only slow migration from traditional pluggable modules will serve the data center, whether within a single line card or server blade, or between cards and racks. Even as recent as a year ago, COBO members began rethinking and changing their tune to stress coexistence of pluggable MSA modules and the embedded on-board modules chosen by COBO as a de facto standard.
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