GN2504C
GN2504C 是一款单向四通道 CDR 重定时器,额定工业温度范围,用于在连接 CFP2、CFP4 和 QSFP28 等新一代模块的线卡上进行免参考 25-28 Gbps 信号调节,也可用于连接新一代 25-28Gbps 背板。适用于有源天线、基带单元等 5G 基站设备。
功能
- 额定工业温度范围
- 4x 25-28Gbps 无参考时钟和数据恢复 (CDR),具有可调均衡功能
- 支持 30 dB 以上的通道损失
- 均衡之后的输入抖动容限:0.75UIpp
- 输入抖动低于 7 pspp
- 高性能串行数据输入
- 灵敏度优于 50 mVppd
- 可调连续时间线性均衡
- 灵活的串行数据输出驱动器
- 可编程摆幅范围广
- 200mVppd 至 1100mVppd
- 可编程输出去加重
- 3D 眼图监视器
- 可编程通道极性反转
- 每通道信号丢失检测
- 每通道 CDR 时钟丢失指示
- 可选同步监视器时钟输出
- PRBS 9、15、31 生成器/检验器
- 集成电压和温度传感器
- 集成 I2C 主机接口
- 1.8V 单电源供电
- 功耗:525mW
- 5mm x 7mm 54 引脚 QFN 封装
- 0.4 mm 引脚间距
- -40 摄氏度到 +100 摄氏度之间运行
- 无铅/符合 RoHS 标准
- 用于 25-28G 数据速率的线卡重定时器
- CEI-28G-VSR 4x25G retimed interfaces
- CAUI-4 4x25G 重定时接口
- 25 G 至 28 G 的背板
- 有源铜缆
应用
封装
- GN2504C-INE3 | 54 引脚 QFN
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资源
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Semtech’s Tri-Edge™ GN2255 is the industry’s first analog IC solution enabling ultra-low latency, less than 1.5W module power, and performance for up to 10km reach for 50Gbps PAM4 SFP56 optical modules. Based on the proven Tri-Edge CDR platform qualified in data center applications, the new solution delivers the cost effectiveness, small footprint, low power, ultra-low latency, and performance demanded by 5G front haul applications. The new Tri-Edge GN2255 enables 50Gbps PAM4 links that will double the bandwidth of currently deployed 25Gbps NRZ front haul links. Semtech’s introduction of the Tri-Edge 5G wireless IC will help support new 5G applications, including edge computing, enhanced mobile broadband and device streaming, and fixed wireless access (i.e., home Internet). Learn more about the product announcement here.
今年早些时候,评估工程 (EE) 与 Semtech 信号完整性产品事业部高级营销经理 Raza Khan 进行了交谈,讨论了行业趋势和新 Tri-Edge 5G 无线产品。
立即阅读在 2018 年进行了大量演示和 alpha 模块测试之后,双密度版本的四通道小型可插拔 (QFSP) 多源协议 (MSA) 模块标准有望成为新线卡的规则。QSFP-DD 热潮的隐含意义不是模块本身的物理特性,而是转向先进信令方法的趋势。十年前,QSFP28 的问世预示着使用 NRZ 信令的 25Gbps 电通道即将占据主导地位。如今,QSFP-DD 及其更庞大的表亲 —— 八进制 SFP 或 OSFP ,都使用 PAM4 信令。其用得最多的是 50Gbps 通道。但 QSFP-DD 足够灵活,可以在各种实施中使用八通道接口:25G x 8 用于 200Gbit 以太网,50G x 8 用于 400Gbit 以太网,可能还有一些早期的 100G x 8 用于预标准 800Gbit 以太网。
立即阅读Slow but steady advances were made in 2018 in on-board optical links for chip-to-chip and chip-to-module interfaces. The integrated-optics revolution, anticipated three years ago when the Consortium for On-Board Optics (COBO), of which Semtech is an associate member, was launched, has been replaced by a realization that only slow migration from traditional pluggable modules will serve the data center, whether within a single line card or server blade, or between cards and racks. Even as recent as a year ago, COBO members began rethinking and changing their tune to stress coexistence of pluggable MSA modules and the embedded on-board modules chosen by COBO as a de facto standard.
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