RClamp3304P
RailClamp is a low capacitance TVS array designed to
protect high speed data interfaces. This series has been
specifically designed to protect sensitive components
which are connected to data and transmission lines from
overvoltage caused by ESD (electrostatic discharge), CDE
(Cable Discharge Events), and EFT (electrical fast transients).
功能
- Transient protection for high-speed data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns) - Array of surge rated diodes with internal TVS Diode
- Small package saves board space
- 保护最多四条 I/O 线路
- Low capacitance (<0.8pF) for high-speed interfaces
- Minimal insertion loss to 3.0GHz
- Low operating voltage: 3.3V
- Low leakage current and clamping voltage
- 固态硅雪崩技术
- Multi Media Card (MMC) Interfaces
- SATA Interfaces
- SD Card Interfaces
- SIM Ports
- MDDI Ports
- MPPI Ports
应用
封装
- SLP1616P6
- 3000 pcs. Tape & Reel
订购代码
- RClamp3304P.TCT
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The U.S. Department of Transportation (USDOT) and the National Highway Traffic Safety Administration (NHTSA) have published regulations that require all cars, SUVs, trucks, and vans to have rear-view visibility systems that started May 1, 2018. In fact, until recently, the rear-view camera was the only camera used in many car models and was considered an excellent safety feature. Modern vehicles have evolved significantly in the past few years, adopting innovative safety features that include blind-spot detection, surround-view monitoring, forward and rear collision warning, lane keep assistance, and autonomous parking assistance. These features utilize cameras and sensors to inform the driver about the car and its surroundings via the dashboard display. Now, there are at least six cameras present in high-end vehicles. There may be video display systems in cars like DVD players and TVs for passengers.
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自 20 世纪初成型以来，汽车行业经历了重大演变，进行了数不清的创新、改变和优化。现代汽车具备复杂的功能，例如倒车摄像头、功能齐全的信息娱乐系统、智能手机底座、GPS 导航、蓝牙连接和其他高级功能。不仅如此，最近一些车型还具备自动驾驶、前后碰撞检测、自动泊车功能。不难想象，车辆中使用的电子元件数量正在激增。同时，为容纳更多新元件，电子元件小型化也变得至关重要。
半导体行业正在生产集成电路 (IC) 的无引线封装，以便为大量电子元件腾出空间，并满足现代汽车的安全性和可靠性要求。行业遇到的一个大挑战是在后封装组装过程中，印刷电路板 (PCB) 上的焊点缺乏可见性。连接位于封装下方，从顶部和侧面均不可见。因此，您无法确定 IC 是否与 PCB 充分焊牢。原始设备制造商 (OEM) 一直在使用 X 射线机来检测不可靠的焊点，但这样既昂贵又耗时。
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One single connecting port's name that is ingrained in our life is Universal Serial Bus or USB in short. It doesn't matter if I am a tech-savvy person or a Luddite, I have to use USB in every aspect of my life. Forget about me; my mom, who doesn't even know it is called USB, uses this port several times a day to charge her mobile devices. USB became very popular due to its ease of use and fast data transfer rate. Within a little over two decades, almost all consumer electronics gadgets come with one or more USB interfaces, from laptops and cameras to smartphones and wearables. However, things have changed a lot since the introduction. USB specification has evolved over 25 years from USB 1.0 in 1996 to the most recent version, USB4®. Figure 1 below shows the evolution of USB standards with the corresponding data transmission rates.
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在我加入 Semtech 的九年里，传输线脉冲 (TLP) 基础知识一直是新员工和客户最重要的培训主题之一。许多人问我们为什么总是强调 TLP 分析的重要性并广泛依赖它为我们的客户提供最佳解决方案。TLP 测试无法提供与行业标准（如 IEC 61000-4-2 或 ESDA/JEDEC JS-001）的规定完全相同的波形。它不保证 IC 或系统能通过所需静电放电 (ESD) 测试级别的抗扰性测试。始终建议在 TLP 测试完成后使用 ESD 发生器验证所有结果。那么，为什么我们不直接全部用 ESD 发生器进行测试？毕竟大多数工程师更熟悉和普遍接受 ESD 发生器。要回答这个问题，我认为务必要理解 TLP 不是 IEC 测试的替代或升级，而是作为一种分析工具对 ESD 枪测试进行补充。ESD 枪测试能告诉我们行或不行，但 TLP 可以帮助我们了解为什么和怎样优化。
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