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在超过 25 年的时间里，Semtech 保护…
在超过 25 年的时间里，Semtech 保护…
Not too long ago, my only fitness tracker was a pedometer in my pocket to measure my daily step count. Things have since changed very quickly. I now have a smartwatch on my wrist to track my daily activities, including steps completed, distance covered, calories burned, heart rate, and breathing pattern. I also receive alerts for messages, take calls, listen to my favorite podcast, and check the weather via my smartwatch. These are all in addition to seeing the accurate time of the day. Due to all these innovative features, wearing a smartwatch and using it as a fitness tracker is the trend for the health-conscious population worldwide. While these wearables help people remain fit, extra care needs to be taken by the manufacturers to protect these wearables from electrical overstress (EOS) and electrostatic discharge (ESD) generated from the body of the person wearing these devices.
Protecting the Health of Fitness Trackers
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The U.S. Department of Transportation (USDOT) and the National Highway Traffic Safety Administration (NHTSA) have published regulations that require all cars, SUVs, trucks, and vans to have rear-view visibility systems that started May 1, 2018. In fact, until recently, the rear-view camera was the only camera used in many car models and was considered an excellent safety feature. Modern vehicles have evolved significantly in the past few years, adopting innovative safety features that include blind-spot detection, surround-view monitoring, forward and rear collision warning, lane keep assistance, and autonomous parking assistance. These features utilize cameras and sensors to inform the driver about the car and its surroundings via the dashboard display. Now, there are at least six cameras present in high-end vehicles. There may be video display systems in cars like DVD players and TVs for passengers.
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自 20 世纪初成型以来，汽车行业经历了重大演变，进行了众多的创新、改变和优化。现代汽车具备复杂的功能，例如倒车摄像头、功能齐全的信息娱乐系统、智能手机底座、GPS 导航、蓝牙连接和其他高级功能。不仅如此，最新的一些车型还具备自动驾驶、前后碰撞检测、自动泊车功能。不难想象，车辆中使用的电子元件数量正在激增。同时，为容纳更多新元件，电子元件小型化也变得至关重要。
半导体行业正在生产集成电路 (IC) 的无引线封装，以便为大量电子元件腾出空间，并满足现代汽车的安全性和可靠性要求。行业遇到的一个大挑战是在后封装组装过程中，印刷电路板 (PCB) 上的焊点缺乏可见性。连接位于封装下方，从顶部和侧面均不可见。因此，无法确定 IC 是否与 PCB 充分焊牢。代工厂 (OEM) 一直在使用 X 射线机来检测不可靠的焊点，但这样既昂贵又耗时。
此外，这种方法也无法用于多层板或具有复杂布局和布线流程的电路板。每个车辆 PCB 都必须经过严格的自动视觉检查 (AVI) 后组装，以符合安全和可靠性标准。其目标是确保每个电气接头都充分焊接并且连接可靠。
One single connecting port's name that is ingrained in our life is Universal Serial Bus or USB in short. It doesn't matter if I am a tech-savvy person or a Luddite, I have to use USB in every aspect of my life. Forget about me; my mom, who doesn't even know it is called USB, uses this port several times a day to charge her mobile devices. USB became very popular due to its ease of use and fast data transfer rate. Within a little over two decades, almost all consumer electronics gadgets come with one or more USB interfaces, from laptops and cameras to smartphones and wearables. However, things have changed a lot since the introduction. USB specification has evolved over 25 years from USB 1.0 in 1996 to the most recent version, USB4®. Figure 1 below shows the evolution of USB standards with the corresponding data transmission rates.
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