RClamp3552T
RailClamp® 3552T is a low voltage RailClamp which can provide ESD protection to IEC 61000-4-2 on highspeed ports. It is manufactured using Semtech's proprietary low voltage technology, designed to minimize both the ESD peak clamping and TLP clamping voltage.
These devices "snap-back" to a low on-state voltage when the breakdown voltage of the device is exceeded. This has the advantage of lowering the overall ESD clamping voltage. When the device is in the on-state, the dynamic resistance is typically 0.30Ω, further minimizing the ESD clamping. Maximum capacitance is only 0.40pF allowing the RClamp3552T to be used in applications operating in excess of 6GHz without appreciable signal attenuation. Each device will protect two lines operating at 3.5 volts.
功能
- High ESD withstand Voltage: +/-17kV (Contact), +/-20kV (Air) per IEC 61000-4-2
- Very small PCB area: 0.6mm2
- Protects up to two data lines
- Low capacitance: 0.40pF Maximum
- Dynamic Resistance: 0.30 Ω Typical
- 低 ESD 钳位电压
- Operating voltage: 3.5V
- 经 AEC-Q100 认证
- 固态硅雪崩技术
- USB 3.0
- V-By-One
- LVDS
- MIPI/MDDI
- MyDP
- Audio Ports
应用
封装
- SLP1006N3T 1.0 x 0.6 x 0.40 mm package
订购代码
- RClamp3552T.TNT: Pb-Free, Halogen Free and RoHS/WEEE Compliant, 10,000 pieces tape and reel, 7 inch reel
Distributor/Catalog Supplier Inventory
View product availability from participating distributors below. Browse all distributers here.
| Part # | 国家/地区 | Qty | Buy | 经销商 |
|---|
Search Pb(Lead)-Free/RoHS-Green Search
（-40°C 至 +85°C / 4000 循环）
（50°C，4000 小时）
（-40°C 至 +85°C / 4000 循环）
（50°C，4000 小时）
（-40°C 至 +85°C / 4000 循环）
（50°C，4000 小时）
Datasheets & Documentation
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资源
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半导体行业正在生产集成电路 (IC) 的无引线封装，以便为大量电子元件腾出空间，并满足现代汽车的安全性和可靠性要求。行业遇到的一个大挑战是在后封装组装过程中，印刷电路板 (PCB) 上的焊点缺乏可见性。连接位于封装下方，从顶部和侧面均不可见。因此，您无法确定 IC 是否与 PCB 充分焊牢。原始设备制造商 (OEM) 一直在使用 X 射线机来检测不可靠的焊点，但这样既昂贵又耗时。
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在我加入 Semtech 的九年里，传输线脉冲 (TLP) 基础知识一直是新员工和客户最重要的培训主题之一。许多人问我们为什么总是强调 TLP 分析的重要性并广泛依赖它为我们的客户提供最佳解决方案。TLP 测试无法提供与行业标准（如 IEC 61000-4-2 或 ESDA/JEDEC JS-001）的规定完全相同的波形。它不保证 IC 或系统能通过所需静电放电 (ESD) 测试级别的抗扰性测试。始终建议在 TLP 测试完成后使用 ESD 发生器验证所有结果。那么，为什么我们不直接全部用 ESD 发生器进行测试？毕竟大多数工程师更熟悉和普遍接受 ESD 发生器。要回答这个问题，我认为务必要理解 TLP 不是 IEC 测试的替代或升级，而是作为一种分析工具对 ESD 枪测试进行补充。ESD 枪测试能告诉我们行或不行，但 TLP 可以帮助我们了解为什么和怎样优化。
TLP Analysis Doesn’t Guarantee Compliance to ESD…
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