GN1057
The Gennum® GN1057 is a fully integrated silicon germanium (SiGe) BiCMOS transimpedance amplifier, providing wideband low noise pre-amplification of a current signal from a PIN photodiode or APD.
It features differential outputs and incorporates automatic gain control (AGC) to improve linear dynamic range. A decoupling capacitor on the supply is the only external component required.
功能
- Single +3.3V power supply
- 功耗 190mW（典型值）
- Bandwidth remains constant over dynamic range
- 小信号增益的典型值为 4kΩ
- RSSI（接收信号强度指示）
- NRZ 速率为 9.95 Gbps 至 11.3 Gbps
- ITU/IEEE-based transmission systems, test equipment and modules including 10GBASE-LRM
- OC-192 fibre optic modules and line termination
- 10 Gigabit Ethernet
- 光纤通道
- Serial data systems up to 11.3Gbps
应用
封装
- Waffle Pack (400pcs)
订购代码
- GN1057CW-CHIP
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资源
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Semtech’s Tri-Edge™ GN2255 is the industry’s first analog IC solution enabling ultra-low latency, less than 1.5W module power, and performance for up to 10km reach for 50Gbps PAM4 SFP56 optical modules. Based on the proven Tri-Edge CDR platform qualified in data center applications, the new solution delivers the cost effectiveness, small footprint, low power, ultra-low latency, and performance demanded by 5G front haul applications. The new Tri-Edge GN2255 enables 50Gbps PAM4 links that will double the bandwidth of currently deployed 25Gbps NRZ front haul links. Semtech’s introduction of the Tri-Edge 5G wireless IC will help support new 5G applications, including edge computing, enhanced mobile broadband and device streaming, and fixed wireless access (i.e., home Internet). Learn more about the product announcement here.
今年早些时候，评估工程 (EE) 与 Semtech 信号完整性产品事业部高级营销经理 Raza Khan 进行了交谈，讨论了行业趋势和新 Tri-Edge 5G 无线产品。
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在 2018 年进行了大量演示和 alpha 模块测试之后，双密度版本的四通道小型可插拔 (QFSP) 多源协议 (MSA) 模块标准有望成为新线卡的规则。QSFP-DD 热潮的隐含意义不是模块本身的物理特性，而是转向先进信令方法的趋势。十年前，QSFP28 的问世预示着使用 NRZ 信令的 25Gbps 电通道即将占据主导地位。如今，QSFP-DD 及其更庞大的表亲 —— 八进制 SFP 或 OSFP ，都使用 PAM4 信令。其用得最多的是 50Gbps 通道。但 QSFP-DD 足够灵活，可以在各种实施中使用八通道接口：25G x 8 用于 200Gbit 以太网，50G x 8 用于 400Gbit 以太网，可能还有一些早期的 100G x 8 用于预标准 800Gbit 以太网。
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Slow but steady advances were made in 2018 in on-board optical links for chip-to-chip and chip-to-module interfaces. The integrated-optics revolution, anticipated three years ago when the Consortium for On-Board Optics (COBO), of which Semtech is an associate member, was launched, has been replaced by a realization that only slow migration from traditional pluggable modules will serve the data center, whether within a single line card or server blade, or between cards and racks. Even as recent as a year ago, COBO members began rethinking and changing their tune to stress coexistence of pluggable MSA modules and the embedded on-board modules chosen by COBO as a de facto standard.
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